Overview	Chinese

    With the combination of the bottom-up self-assembly process and the traditional top-down lithographic fabrication technologies, various innovative and extraordinary nano-devices and systems are emerging, such as flexible electronics and solar cells. Among many of the technologies related to nano-science and technology, nano-imprint process, nano-interconnects, and nano-contacts play the key roles in manufacturing and integrating the revolutionary nano-devices with outstanding performance into a practical system. Integration schemes that are cost effective and that have high production yields need to be developed for these nano-structured systems to be successfully implemented.

    ISMEN symposium aims to provide a forum for researchers around the world to exchange the latest advances in materials, processes, integration, and reliability in areas of advanced nano-imprinting, nano-interconnects, nano-contacts, and flexible electronics. Invited speakers and posters and discussion sessions will be arranged in a three-day long program at National Cheng Kung University, Tainan, Taiwan.

 

Organized by:

Department of Materials Science and Engineering, National Cheng Kung University, Taiwan.
Center for Micro/Nano Science and Technology.